Wireless Interface Technologies for 3D IC and Module Integration

Wireless Interface Technologies for 3D IC and Module Integration
Tadahiro Kuroda, Wai-Yeung Yip
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NZ$ 224.95
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NZ$ 202.46
Hardback
Not defined - 300pg
30 Sep 2021 UK
International import eta 7-19 days
9781108841214
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Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2. 5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE. Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.
Status: No local stock, title imported to order
ISBN-13: 9781108841214
Published: 30 Sep 2021
Published In: United Kingdom
Imprint: Cambridge University Press
Publisher: Cambridge University Press
Format: Hardback
Pages: 300

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